MS.5.P122 Composition dependence of morphology, electrical and mechanical properties of sputtered Cu-Mn alloy films

Nagy, K., Misj, F., Szommer, P., Lobotka, P., Radn, G.

Keywords: Cu-Mn alloy films, TEM, resistivity, hardness, structure

Subjects: Materials Science (MS)

URN: urn:nbn:de:bvb:355-mc2013-662-8

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